An experimental investigation was made of the application of holographic interferometry to the nondestructive detection of unbonded areas (flaws) in bonded panels. Flaw detection results were compared with results obtained with an ultrasonic flaw detector. Holography, with panel deformation accomplished by a reduction in ambient pressure, is less sensitive for flaws beneath 5 and 10 plies of boron-epoxy than the ultrasonic method, though it does have its operational advantages. A process for the manufacture of bonded panels which incorporate known unbonded areas was also developed. The unbonded areas were formed without the use of foreign materials, which makes the method suitable for the construction of reference standards for bonded panels whenever needed for the proper setup of ultrasonic flaw-detection instruments.